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Finally, a Likely Explanation for the “Sonic Weapon” Used at the U.S. Embassy in Cuba

Researchers say bad engineering, not a deliberate attack, may be to blame

4 min read
Photo of the closed U.S. embassy in Cuba.
Sonic Mystery: At least 24 employees of the U.S. embassy in Cuba heard high-pitched sounds between December 2016 and August 2017, and suffered injuries thought to be related to the noise.
Photo: Alexandre Meneghini/Reuters

Last August, reports emerged that U.S. and Canadian diplomats in Cuba had suffered a host of mysterious ailments. Speculation soon arose that a high-frequency sonic weapon was to blame. Acoustics experts, however, were quick to point out the unlikeliness of such an attack. Among other things, ultrasonic frequencies—from 20 to 200 kilohertz—don’t propagate well in air and don’t cause the ear pain, headache, dizziness, and other symptoms reported in Cuba. Also, some victims recalled hearing high-pitched sounds, whereas ultrasound is inaudible to humans.

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Two Startups Are Bringing Fiber to the Processor

Avicena’s blue microLEDs are the dark horse in a race with Ayar Labs’ laser-based system

5 min read
Diffuse blue light shines from a patterned surface through a ring. A blue cable leads away from it.

Avicena’s microLED chiplets could one day link all the CPUs in a computer cluster together.

Avicena

If a CPU in Seoul sends a byte of data to a processor in Prague, the information covers most of the distance as light, zipping along with no resistance. But put both those processors on the same motherboard, and they’ll need to communicate over energy-sapping copper, which slow the communication speeds possible within computers. Two Silicon Valley startups, Avicena and Ayar Labs, are doing something about that longstanding limit. If they succeed in their attempts to finally bring optical fiber all the way to the processor, it might not just accelerate computing—it might also remake it.

Both companies are developing fiber-connected chiplets, small chips meant to share a high-bandwidth connection with CPUs and other data-hungry silicon in a shared package. They are each ramping up production in 2023, though it may be a couple of years before we see a computer on the market with either product.

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