Chip Making’s Singular Future

Beleaguered chip makers are counting on single-wafer manufacturing, which makes ICs on one wafer at a time, to cut costs and get chips to market faster

14 min read
Opening illustration for this feature article.
Illustration: John MacNeill

Since the invention of the integrated circuit in 1958, the number of processing steps required to make one has grown from less than 10 to several hundreds. At the same time, the silicon wafers on which the ICs are produced have gone from being coin-sized to being dinner-plate-sized.

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The James Webb Space Telescope was a Career-Defining Project for Janet Barth

NASA’s first female engineering chief was there from conception to first light

5 min read
portrait of older woman in light blue jacket against dark gray background Info for editor if needed:
Sue Brown

Janet Barth spent most of her career at the Goddard Space Flight Center, in Greenbelt, Md.—which put her in the middle of some of NASA’s most exciting projects of the past 40 years.

She joined the center as a co-op student and retired in 2014 as chief of its electrical engineering division. She had a hand in Hubble Space Telescope servicing missions, launching the Lunar Reconnaissance Orbiter and the Magnetospheric Multiscale mission, and developing the James Webb Space Telescope.

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A Diamond "Blanket" Can Cool the Transistors Needed for 6G

Gallium nitride transistors have struggled to handle the thermal load of high-frequency electronics

4 min read
blue mountain of crystals with an inset of molecules on a pink background
Srabanti Chowdhury/Stanford

High-power radio-frequency electronics are a hot commodity, both figuratively and literally. The transistors needed to amplify 5G and future 6G signals are struggling to handle the thermal load, causing a bottleneck in development. Engineers in the United States and England have teamed up to demonstrate a promising solution—swaddling individual transistors in a blanket of thermally conductive diamond to keep them cool.

“Thermal issues are currently one of the biggest bottlenecks that are plaguing any kind of microelectronics,” says team lead Srabanti Chowdhury, professor of electrical engineering at Stanford University. “We asked ourselves ‘can we perform device cooling at the very material level without paying a penalty in electrical performance?’”

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Fourth Generation Digitizers With Easy-to-Use API

Learn about the latest generation high-performance data acquisition boards from Teledyne

1 min read

In this webinar, we explain the design principles and operation of our fourth-generation digitizers with a focus on the application programming interface (API).

Register now for this free webinar!

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