The December 2022 issue of IEEE Spectrum is here!

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Photo of Tero Ojanperä
Photo: David Yellen

This profile is part of IEEE Spectrum’s Special Report on Dream Jobs 2009.

Photo of Tero Ojanper\u00e4Listen Up: Tero Ojanperä, an IEEE member, Ph.D. electrical engineer, and former CTO, now hears the beat of a different drummer: He heads Nokia’s entertainment division.Photo: David Yellen

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Video Friday: Humanoid Soccer

Your weekly selection of awesome robot videos

4 min read
Humans and human-sized humanoid robots stand together on an indoor soccer field at the beginning of a game

Video Friday is your weekly selection of awesome robotics videos, collected by your friends at IEEE Spectrum robotics. We also post a weekly calendar of upcoming robotics events for the next few months. Please send us your events for inclusion.

CoRL 2022: 14–18 December 2022, AUCKLAND, NEW ZEALAND
ICRA 2023: 29 May–2 June 2023, LONDON

Enjoy today’s videos!

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Array of devices on a chip

This analog electrochemical memory (ECRAM) array provides a prototype for artificial synapses in AI training.

IBM research

How far away could be an artificial brain? Perhaps a very long way still, but a working analogue to the essential element of the brain’s networks, the synapse, appears closer at hand now.

That’s because a device that draws inspiration from batteries now appears surprisingly well suited to run artificial neural networks. Called electrochemical RAM (ECRAM), it is giving traditional transistor-based AI an unexpected run for its money—and is quickly moving toward the head of the pack in the race to develop the perfect artificial synapse. Researchers recently reported a string of advances at this week’s IEEE International Electron Device Meeting (IEDM 2022) and elsewhere, including ECRAM devices that use less energy, hold memory longer, and take up less space.

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Learn How Global Configuration Management and IBM CLM Work Together

In this presentation we will build the case for component-based requirements management

2 min read

This is a sponsored article brought to you by 321 Gang.

To fully support Requirements Management (RM) best practices, a tool needs to support traceability, versioning, reuse, and Product Line Engineering (PLE). This is especially true when designing large complex systems or systems that follow standards and regulations. Most modern requirement tools do a decent job of capturing requirements and related metadata. Some tools also support rudimentary mechanisms for baselining and traceability capabilities (“linking” requirements). The earlier versions of IBM DOORS Next supported a rich configurable traceability and even a rudimentary form of reuse. DOORS Next became a complete solution for managing requirements a few years ago when IBM invented and implemented Global Configuration Management (GCM) as part of its Engineering Lifecycle Management (ELM, formerly known as Collaborative Lifecycle Management or simply CLM) suite of integrated tools. On the surface, it seems that GCM just provides versioning capability, but it is so much more than that. GCM arms product/system development organizations with support for advanced requirement reuse, traceability that supports versioning, release management and variant management. It is also possible to manage collections of related Application Lifecycle Management (ALM) and Systems Engineering artifacts in a single configuration.

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