This is a sponsored article brought to you by Master Bond.

Sensitive electronic components and other parts that may be damaged due to vibration, shock, or handling can often benefit from adhesive staking. Staking provides additional mechanical reinforcement to these delicate pieces.

Different components require different methods of staking. Dual inline packages (DIP) and capacitors, for example, will need distinctive staking approaches for the optimal outcome. For the DIP, the goal is to connect the corners of the component to the circuit board while ensuring that the material does not flow under the component.

To achieve this, use a fine tip syringe with a high viscosity compound and apply the adhesive to each the four corners. For a capacitor, there are several options. You can apply the adhesive to the edge of the component, stake at multiple locations, or even apply the material around the entire component.

Watch the video to see the staking methods.

Here, the objective is to attain enhanced stability while making a mechanical connection with the circuit board. After the material is applied, it must be cured according to the instructions on the technical data sheet.

To demonstrate these staking methods, Master Bond used one part epoxy system EP17HTDA-1. EP17HTDA-1 is a thermally conductive, electrically insulative material featuring a paste viscosity. It is a no mix system that cures in as little as one to two hours at 350° F, with minimal shrinkage. Its consistency is ideal for die attach applications.

EP17HTDA-1 specifications, including thermal, volume, viscosity, and cure specs

EP17HTDA-1 is a thermally conductive, electrically insulative material featuring a paste viscosity.

Master Bond

Other notable properties include high temperature resistance up to +600° F, excellent chemical resistance, NASA low outgassing, and MIL-STD-883J Section 3.5.2 for thermal stability.

Learn more about adhesive staking and how it can improve your applications.

The Conversation (0)

3D-Stacked CMOS Takes Moore’s Law to New Heights

When transistors can’t get any smaller, the only direction is up

10 min read
An image of stacked squares with yellow flat bars through them.
Emily Cooper

Perhaps the most far-reaching technological achievement over the last 50 years has been the steady march toward ever smaller transistors, fitting them more tightly together, and reducing their power consumption. And yet, ever since the two of us started our careers at Intel more than 20 years ago, we’ve been hearing the alarms that the descent into the infinitesimal was about to end. Yet year after year, brilliant new innovations continue to propel the semiconductor industry further.

Along this journey, we engineers had to change the transistor’s architecture as we continued to scale down area and power consumption while boosting performance. The “planar” transistor designs that took us through the last half of the 20th century gave way to 3D fin-shaped devices by the first half of the 2010s. Now, these too have an end date in sight, with a new gate-all-around (GAA) structure rolling into production soon. But we have to look even further ahead because our ability to scale down even this new transistor architecture, which we call RibbonFET, has its limits.

Keep Reading ↓Show less