Largest current configuration:6 wafers; 1.2 million neurons; 300 million synapses Next configuration: 20 wafers,  4 million neurons; 1 billion synapses Final configuration: 5,000 wafers; 5 billion neurons; 1.3 trillion synapses
Project features:Emphasizes biological realism with learning capabilities on chip; has flexible, programmable routing approach. Analog or Digital: Hybrid Manufacturing process: 90 nm
Largest current configuration:4 Wafes; 2,304 neurons; 292,000 synapses Next configuration: 4 Chips; 4,096 neurons; 520,000 synapses Final configuration:  Info not available
Project features:Low-power neuromorphic chip designed for applications in mobile sensors, cloud computing, and so on. Analog or Digital: Digital  Manufacturing process: 28 nm
Largest current configuration:16 Chips; 16 million neurons; 4 billion synapses Next configuration: 4,096 Chips; 4 billion neurons; 1 trillion synapses Final configuration: 10 billion neurons; 100 trillion synapses
Project features:Enables low-power, large-scale digital model of brain; helps improve models of brain diseases. Analog or Digital: DigitalManufacturing process: 130 nm
Project features:Simulates biologically realistic brain models; team has moved on to autonomous robot applications.  Analog or Digital: Hybrid Manufacturing process: 180 nm
Largest current configuration: 1152 Chips; Up to 20 million neurons; 20 billion synapses Next configuration: 5,750 Chips; up to 100 million neurons; 100 billion synapses Final configuration: Up to 1 billion neurons; 1 trillion synapses
Largest current configuration:  16 Chips; 1 million neurons; 8 billion synapses Next configuration:  Info not available Final configuration:  Info not available
Project features:Simulates brain activity at 10,000 times normal speed to compress a day into 10 seconds; focuses on studying brain learning and plasticity.  Analog or Digital: Hybrid Manufacturing process:  180 nanometers (Goal: 65 nm)