How to Make Autonomous Cars Trustworthy and Free from Cybersecurity Threats

Automotive experts discuss the challenges and solutions in these free on-demand webinars

1 min read
Cars on a road with data overlaying each car.
Photo-illustration: iStockphoto

Autonomous vehicles are becoming smarter because they are being powered by computerization and artificial intelligence. They eventually will be able to communicate with each other and the infrastructure, maneuver flexibly while sensing their surroundings, and allow drivers to go from being operators to passengers.

The rise of autonomous vehicles also brings about risks and vulnerabilities, however. Can smart cars be trusted? How can the cybersecurity of connected cars be ensured?

Two free, on-demand webinars from the IEEE Standards Association bring together industry leaders to discuss the challenges facing autonomous vehicles and ways to use the technology safely and reliably.

Standards for Trustworthy Autonomous Vehicles To be widely accepted and adopted, autonomous vehicles have to be safe, secure, reliable, resilient, and more. Key industry leaders share their ideas and present recent research results. They also address industrial challenges, risks, and vulnerabilities. Attendees get to learn how related technical standards activities can help shape markets and facilitate the commercialization of new technologies.

Cyber-Secured Autonomous Vehicles Experts in the field address security vulnerabilities and risks throughout the lifetime of an autonomous vehicle. Different viewpoints, initiatives, and priorities from Asia, Europe, and the United States are covered. A panel discussion with the speakers organized as a Q&A session identifies the commonalities and differences of approaches and solutions. To access this webinar, you'll first need to complete a registration form.

IEEE membership offers a wide range of benefits and opportunities for those who share a common interest in technology. If you are not already a member, consider joining IEEE and becoming part of a worldwide network of more than 400,000 students and professionals.

The Conversation (0)

Get unlimited IEEE Spectrum access

Become an IEEE member and get exclusive access to more stories and resources, including our vast article archive and full PDF downloads
Get access to unlimited IEEE Spectrum content
Network with other technology professionals
Establish a professional profile
Create a group to share and collaborate on projects
Discover IEEE events and activities
Join and participate in discussions

3D-Stacked CMOS Takes Moore’s Law to New Heights

When transistors can’t get any smaller, the only direction is up

10 min read
An image of stacked squares with yellow flat bars through them.
Emily Cooper

Perhaps the most far-reaching technological achievement over the last 50 years has been the steady march toward ever smaller transistors, fitting them more tightly together, and reducing their power consumption. And yet, ever since the two of us started our careers at Intel more than 20 years ago, we’ve been hearing the alarms that the descent into the infinitesimal was about to end. Yet year after year, brilliant new innovations continue to propel the semiconductor industry further.

Along this journey, we engineers had to change the transistor’s architecture as we continued to scale down area and power consumption while boosting performance. The “planar” transistor designs that took us through the last half of the 20th century gave way to 3D fin-shaped devices by the first half of the 2010s. Now, these too have an end date in sight, with a new gate-all-around (GAA) structure rolling into production soon. But we have to look even further ahead because our ability to scale down even this new transistor architecture, which we call RibbonFET, has its limits.

Keep Reading ↓Show less