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Flexible Graphene Memristors

Graphene oxide is the latest flavor of memristor, and it works on bendable plastic

3 min read

13 October 2010—South Korean researchers have recently made a flexible nonvolatile memory based on memristors—fundamental electronic circuit elements discovered in 2008—using thin graphene oxide films. Memristors promise a new type of dense, cheap, and low-power memory and have typically been made using metal oxide thin films. The new graphene oxide devices should be cheaper and simpler to fabricate—they could be printed on rolls of plastic sheets and used in plastic RFID tags or in the wearable electronics of the future.

"We think graphene oxide can be a good candidate for next-generation memory," says Sung-Yool Choi, who leads flexible devices research at the Electronics and Telecommunications Research Institute in Daejeon, South Korea. Choi and his colleagues reported their device last week in Nano Letters.

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Two Startups Are Bringing Fiber to the Processor

Avicena’s blue microLEDs are the dark horse in a race with Ayar Labs’ laser-based system

5 min read
Diffuse blue light shines from a patterned surface through a ring. A blue cable leads away from it.

Avicena’s microLED chiplets could one day link all the CPUs in a computer cluster together.

Avicena

If a CPU in Seoul sends a byte of data to a processor in Prague, the information covers most of the distance as light, zipping along with no resistance. But put both those processors on the same motherboard, and they’ll need to communicate over energy-sapping copper, which slow the communication speeds possible within computers. Two Silicon Valley startups, Avicena and Ayar Labs, are doing something about that longstanding limit. If they succeed in their attempts to finally bring optical fiber all the way to the processor, it might not just accelerate computing—it might also remake it.

Both companies are developing fiber-connected chiplets, small chips meant to share a high-bandwidth connection with CPUs and other data-hungry silicon in a shared package. They are each ramping up production in 2023, though it may be a couple of years before we see a computer on the market with either product.

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