First Graphene Photodetector To Operate in the Microwave

New photodetector is 100,000 times as sensitive to light as previous graphene photodetectors

2 min read
DGIST's senior researcher Jeong Min-kyung
Photo: DGIST

While graphene may be losing its luster in the field of digital electronics because of its lack of an inherent band gap,  in the world of optoelectronics graphene’s gapless band structure seems to be winning a new set of acolytes. This is seen no more keenly than in photodetectors, where graphene is enabling near-terahertz-speed photodetectors that are more energy efficient.

Now, researchers at the Daegu Gyeongbuk Institute of Science and Technology (DGIST) in South Korea and the University of Basel in Switzerland have developed a new graphene-based photodetector that operates at microwave wavelengths—a departure from graphene photodetectors that detect only optical wavelengths from the near-infrared to ultraviolet light.

“The significance of this study is that we have developed the world's first microwave photodetector using graphene device,” said senior researcher Jung Min-kyung of DGIST, in a press release.

The device can detect 100,000 times less light energy than any existing graphene photodetector.

In research described in the journal Nano Letters, the international team of researchers studied the microwave absorption capabilities of bilayer graphene arranged into p-n junctions—the points at which p-type and n-type semiconductors are joined together to form the basis of many of the electronic devices we are familiar with.

Of course, there has been previous research attempts to study the microwave range in photodetection, but these attempts failed because the microwave on the detector itself had much smaller energy than the surface potential difference caused by the surrounding environment. Those error-causing issues included residues on the surface of graphene that were left behind during its fabrication.

To overcome that problem, the researchers essentially created a bridge over troubled water. They separated the graphene-based p-n junction from the substrate by creating a bridge-like structure that suspended the p-n junction above the substrate. This bridge essentially allows the electrons to flow without bumping up against the obstacles created by the residues on the device.

The researchers were able to confirm that they had in fact produced a microwave photodetector by detecting a photocurrent through the measurement of the temperature differences between the electrodes. Basically, as the electron-hole pairs were increasingly being produced in the graphene p-n junction, the temperature of the p-n junction increased.

The researchers seem to be considering this microwave photodetector for use in wearable devices and flexible displays. Jung Min-kyung added: “We will carry out further research to improve the performance of wearable devices and flexible displays by developing new application devices such as a large-area microwave photodetector using a single device based graphene.”

The Conversation (0)

3 Ways 3D Chip Tech Is Upending Computing

AMD, Graphcore, and Intel show why the industry’s leading edge is going vertical

8 min read
Vertical
A stack of 3 images.  One of a chip, another is a group of chips and a single grey chip.
Intel; Graphcore; AMD
DarkBlue1

A crop of high-performance processors is showing that the new direction for continuing Moore’s Law is all about up. Each generation of processor needs to perform better than the last, and, at its most basic, that means integrating more logic onto the silicon. But there are two problems: One is that our ability to shrink transistors and the logic and memory blocks they make up is slowing down. The other is that chips have reached their size limits. Photolithography tools can pattern only an area of about 850 square millimeters, which is about the size of a top-of-the-line Nvidia GPU.

For a few years now, developers of systems-on-chips have begun to break up their ever-larger designs into smaller chiplets and link them together inside the same package to effectively increase the silicon area, among other advantages. In CPUs, these links have mostly been so-called 2.5D, where the chiplets are set beside each other and connected using short, dense interconnects. Momentum for this type of integration will likely only grow now that most of the major manufacturers have agreed on a 2.5D chiplet-to-chiplet communications standard.

Keep Reading ↓Show less
{"imageShortcodeIds":[]}