Spectrum Webcasts

Tech Insider: Simulation Solutions to Electronics Thermal Management

"On Demand"

Presenters:
Fadi Ben Achour, Director of Industry Marketing for Electronics, ANSYS
Manoj Nagulapally, Project Manager, ANSYS

Looking for a better engineering simulation solution to predict how your product designs will behave in manufacturing and real-world environments? Increasingly, companies are turning to innovative, integrated, modular, and extensible solutions that address designs and applications.

Learn from industry experts about thermal management by predicting air flow and heat transfer from the component to the cabinet level. Discussion will focus on thermal management using computational fluid dynamics (CFD) and finite element analysis (FEA) for package, board and system level electronics. The presentation will also include a demo of real-world simulation solutions through a series of examples of electronics cooling.

Who should attend:

• Package Designers
• Semiconductor/Component designers
• Mechanical Engineers/Designers
• MEMS Designers
• Thermal Engineers
• Board Layout Engineers
• Project Managers
• Engineering Management
• Academia